Mechanical Engineer (Electronic Warfare)

Harmattan AI · Paris · publiée le 2026-08-28 · ouverte depuis 7 jours

Les missions

As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.
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Annonce complèteABOUT US Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces. Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected. ABOUT THE ROLE As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams. RESPONSIBILITIES - RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role). - Thermal Management: Design thermal solutions for high-power, high-density electronics. - Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints. - Mechanical Design: Own mechanical design from concept through prototyping and validation. - Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces. - System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability. CANDIDATE REQUIREMENTS - Experience in RF electronic packaging is a must. - Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.). - Strong background in mechanical design, thermal management and packaging. - Broad engineering culture with understanding of electrical and embedded systems. - MSc in Mechanical Engineering; PhD is a plus. - Rigorous, structured and mission-driven mindset with strong analytical skills. - Excellent communication and documentation abilities. We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.

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